Saint-Gobain High Performance Seals make its debut for SEMICON CHINA 2019

2019-03-22

SEMICON CHINA 2019 was held at Shanghai on 20-22 March which attracted the world's leading technology companies who design, develop, manufacture, and supply the technologies to manufacture the microelectronics that drive today's most sophisticated consumer and commercial electronic products.

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Saint-Gobain Seals team exhibited their innovative seals solutions for semiconductor industry for this time. Meldin®-HIGH-PERFORMANCE THERMOSET POLYIMIDE MATERIALS and OmniSeal®-SPRING-ENERGIZED SEALS which meet the needs of high purity, high resistance to solvents, oils, and other process chemicals, and high electrical insulative properties which attracted a lot of professional vistors.

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Also, our FURON, VERSILON products, including high purify valves, pumps, connection parts which provide safe and efficient chemical transmission received many onsite inquires.

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As a leading company who always serve electronic and semiconductor industries. The R&D and engineering team from Saint-Gobain offer customized solutions to meet customer needs.   

Contact: Athrun LIN

Athrun.lin@saint-gobain.com